- EUV Lithography (Process, Equipment, Photoresist, Masks, etc.)
- Plasma and Chemical Processes (Etch, Diffusion, Thin Films, etc.)
- Chemical Mechanical Polish, Strained Silicon and HiK metal gate processes
- Damascene and C4 interconnects
- TSV / 3DI / Power Via and MRAM innovations
- Nano-ribbons / Gate All Around architectures
- Process Integration
- Defect / Yield Analysis and Optimization